Forming tapered pattern by Cu electrodeposition through mask on Ni seed layer for thin-film transistors

Shrane Ning Jenq*, Chi Chao Wan, Yung Yun Wang, Hung Wei Li, Po-Tsun Liu, Jing Hon Chen

*此作品的通信作者

研究成果: Article同行評審

2 引文 斯高帕斯(Scopus)

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Engineering & Materials Science

Physics & Astronomy