An experimental study has been carried out on rubber I transfer molding. It reveals that the filling is frequently limited more by the resistance of flow across the transfer pot than by resistance of flow through the sprue holes into the cavities. A mathematical model has been derived, which predicts semi‐quantitatively the molding behavior observed. The mode1 predicts that fill time is proportional to the ratio of compound viscosity divided by molding pressure raised to about the fourth power. For the common cases where most of the fill time is from the resistance to the transverse flow on the top of the sprue plate, the fill time is proportional to about the fifth power of the ratio of transverse distance divided by the charge thickness. Experimental results showed that preheating and mastication of the compound reduced transfer time substantially. The charge pattern did not seem to have a major influence on transfer time.