First fully functionalized monolithic 3D+ IoT chip with 0.5 v light-electricity power management, 6.8 GHz wireless-communication VCO, and 4-layer vertical ReRAM

Fu Kuo Hsueh, Chang Hong Shen, Jia Min Shieh, Kai Shin Li, Hsiu Chih Chen, Wen Hsien Huang, Hsing Hsiang Wang, Chih Chao Yang, Tung Ying Hsieh, Chang Hsien Lin, Bo Yuan Chen, Yu Shao Shiao, Guo Wei Huang, Oi Ying Wong, Po-Hung Chen, Wen Kuan Yeh