Finite element analysis of ultrasonic vibration-assisted microstructure hot glass embossing process

Lan Phuong Nguyen*, Ming Hui Wu, Ching-Hua Hung

*此作品的通信作者

研究成果: Article同行評審

6 引文 斯高帕斯(Scopus)

摘要

Hot glass embossing is a novel technology to manufacture microtips for Field Emission Displays with high quality and low cost. This technology recently has been assisted by ultrasonic vibration. Previous studies showed that high energy of ultrasonic vibration would lead to the temperature rise inside the glass so that micro-formability of glass material has been especially improved efficiently. However, these findings were experimental only. Therefore, this work is aimed to utilise the proposed model in the previous study to analyse the shape of pyramid structures on K-PSK100 optical glass substrate during ultrasonic vibration-assisted hot glass embossing process. Microstructure hot embossing experiments were first conducted without and with the assistance of ultrasonic vibration (frequency of 35 kHz and amplitude of 3 μm). Three-dimensional simulations were then performed to predict the height of pyramids after hot embossing process. The consistency between simulations and experiments not only proved that ultrasonic vibration could increase the filling ability of glass material into microcavities up to 17% but also indicated the value of the proposed model in predicting the final shape of microstructures after ultrasonic vibration-assisted hot glass embossing process.

原文English
頁(從 - 到)199-208
頁數10
期刊Australian Journal of Mechanical Engineering
17
發行號3
DOIs
出版狀態Published - 1 1月 2019

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