TY - GEN
T1 - Fine-pitch <111>-oriented NT-Cu/SiO2hybrid joints with high thermal fatigue resistance and low contact resistivity
AU - Ong, Jia Juen
AU - Chiu, Wei Lan
AU - Chang, Hsiang Hung
AU - Tran, Dinh Phuc
AU - Chen, Chih
N1 - Publisher Copyright:
© 2023 Japan Institute of Electronics Packaging.
PY - 2023
Y1 - 2023
N2 - Fine-pitched NT-Cu/SiO2 hybrid bonding can be successfully fabricated under 200 °C by deploying highly <111>-oriented NT-Cu as bonding metal. To further study the reliability to the thermal fatigue, TCT and HTS conducted. According to JEDEC test standard, all sample passed by within ~7% of resistance increment.
AB - Fine-pitched NT-Cu/SiO2 hybrid bonding can be successfully fabricated under 200 °C by deploying highly <111>-oriented NT-Cu as bonding metal. To further study the reliability to the thermal fatigue, TCT and HTS conducted. According to JEDEC test standard, all sample passed by within ~7% of resistance increment.
KW - Fine-pitch Cu/SiOhybrid bonding
KW - High thermal fatigue
KW - Reliability analysis
KW - low contact resistivity
KW - low temperature bonding
UR - https://www.scopus.com/pages/publications/85161873345
U2 - 10.23919/ICEP58572.2023.10129702
DO - 10.23919/ICEP58572.2023.10129702
M3 - Conference contribution
AN - SCOPUS:85161873345
T3 - 2023 International Conference on Electronics Packaging, ICEP 2023
SP - 15
EP - 16
BT - 2023 International Conference on Electronics Packaging, ICEP 2023
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 22nd International Conference on Electronics Packaging, ICEP 2023
Y2 - 19 April 2023 through 22 April 2023
ER -