Fine-pitch <111>-oriented NT-Cu/SiO2hybrid joints with high thermal fatigue resistance and low contact resistivity

Jia Juen Ong, Wei Lan Chiu, Hsiang Hung Chang, Dinh Phuc Tran, Chih Chen*

*此作品的通信作者

研究成果: Conference contribution同行評審

摘要

Fine-pitched NT-Cu/SiO2 hybrid bonding can be successfully fabricated under 200 °C by deploying highly <111>-oriented NT-Cu as bonding metal. To further study the reliability to the thermal fatigue, TCT and HTS conducted. According to JEDEC test standard, all sample passed by within ~7% of resistance increment.

原文English
主出版物標題2023 International Conference on Electronics Packaging, ICEP 2023
發行者Institute of Electrical and Electronics Engineers Inc.
頁面15-16
頁數2
ISBN(電子)9784991191152
DOIs
出版狀態Published - 2023
事件22nd International Conference on Electronics Packaging, ICEP 2023 - Kumamoto, Japan
持續時間: 19 4月 202322 4月 2023

出版系列

名字2023 International Conference on Electronics Packaging, ICEP 2023

Conference

Conference22nd International Conference on Electronics Packaging, ICEP 2023
國家/地區Japan
城市Kumamoto
期間19/04/2322/04/23

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