Fine-Feature Cu/In Interconnect Bonding Using Single Sided Heating and Chip-to-Wafer Bonding Technology

Shih Wei Lee, Ching Yun Chang, Geng Ming Chang, Kuan-Neng Chen*

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    1 引文 斯高帕斯(Scopus)

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    Engineering & Materials Science

    Chemical Compounds

    Medicine & Life Sciences