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Feature profile evolution in plasma processing using wireless on-wafer monitoring system
Seiji Samukawa
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電信工程研究所
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引文 斯高帕斯(Scopus)
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Keyphrases
3D Structure
50%
Current Sheath
50%
Etch Profile
50%
Feature Profiles
100%
Ion Current Density
50%
Ion Sheath
50%
Ion Trajectory
50%
Ion-ion
50%
Monitoring System
100%
Neural Network
50%
On-wafer
100%
Plasma Processing
100%
Profile Evolution
100%
Sensor Measurement
50%
Sensor-based
50%
Shape Sensor
50%
Sheath Thickness
50%
Sheath Voltage
50%
Simulation-based
50%
Vertical Step
100%
Wireless
100%
Engineering
Dimensional Structure
100%
Ion Current Density
100%
Measured Parameter
100%
Monitoring System
100%
Plasma Applications
100%
Sensor Measurement
100%
Sheath Voltage
100%
Earth and Planetary Sciences
Current Density
100%
Ion Current
100%
Ion Sheaths
100%
Monitoring System
100%
Plasma Process
100%
Physics
Ion Current
100%
Neural Network
100%
Plasma Process
100%
Chemical Engineering
Neural Network
100%
Plasma Process
100%
Material Science
Density
100%