TY - GEN
T1 - Fast host service interface design for embedded Java application processor
AU - Su, Kuan Nian
AU - Tsai, Chun-Jen
PY - 2009/10/26
Y1 - 2009/10/26
N2 - In this paper, we have proposed a fast inter-processor communication interface (IPC) for a dual-core Java application processor. The dual-core Java application processor is a SoC composed of a RISC core and a double-issued Java bytecode execution core. The proposed fast IPC mechanism provides Java system software a high-level way to invoke a host processor service routine from Java source code. The proposed IPC has much lower overhead than that of the standard Java Native Interface (JNI). Unlike other fast native call interface designed for VM interpreter, the proposed IPC mechanism is exclusively designed for the communication between two physical hardwired processor cores. Based on the experimental results, the proposed mechanism is very promising for embedded Java runtime environment.
AB - In this paper, we have proposed a fast inter-processor communication interface (IPC) for a dual-core Java application processor. The dual-core Java application processor is a SoC composed of a RISC core and a double-issued Java bytecode execution core. The proposed fast IPC mechanism provides Java system software a high-level way to invoke a host processor service routine from Java source code. The proposed IPC has much lower overhead than that of the standard Java Native Interface (JNI). Unlike other fast native call interface designed for VM interpreter, the proposed IPC mechanism is exclusively designed for the communication between two physical hardwired processor cores. Based on the experimental results, the proposed mechanism is very promising for embedded Java runtime environment.
UR - http://www.scopus.com/inward/record.url?scp=70350172804&partnerID=8YFLogxK
U2 - 10.1109/ISCAS.2009.5118016
DO - 10.1109/ISCAS.2009.5118016
M3 - Conference contribution
AN - SCOPUS:70350172804
SN - 9781424438280
T3 - Proceedings - IEEE International Symposium on Circuits and Systems
SP - 1357
EP - 1360
BT - 2009 IEEE International Symposium on Circuits and Systems, ISCAS 2009
T2 - 2009 IEEE International Symposium on Circuits and Systems, ISCAS 2009
Y2 - 24 May 2009 through 27 May 2009
ER -