Failure analysis for electronic devices on flexible substrate

Shih Ting Liu*, Tao Chi Liu, Ming Lun Chang, King Ting Chiang, Su Ping Chiu, Jandel Lin, Po Yuan Lo, Pei-Wen Li

*此作品的通信作者

研究成果: Conference contribution同行評審

2 引文 斯高帕斯(Scopus)

摘要

Since organic materials are easily damaged, failure analysis of electronic devices on flexible substrate using practice FA techniques is hard to procure. However, worse uniformity of organic thin film and high driving voltage may result in failures seldom discovered in conventional Si-based device. This paper aims to analyze the failures of organic thin-film transistors (OTFTs) by the techniques established in this study, involving non-destructive detection, and electrical failure localization. Results of this study showed that the existence of voids in the dielectric not only caused abnormality of electrical features, but also resulted in violent failure with high driving voltage punching. We successfully demonstrated the failure induced by high driving voltage, particular elongation of gate metal, using TEM observation. To conclude, analysis of electrical failure for flexible devices is the main object. This research is a great enhancement in failure analysis of devices and packages comprising organics and flexible substrate.

原文English
主出版物標題IMPACT Conference 2009 International 3D IC Conference - Proceedings
頁面392-394
頁數3
DOIs
出版狀態Published - 1 十二月 2009
事件IMPACT Conference 2009 International 3D IC Conference - Taipei, Taiwan
持續時間: 21 十月 200923 十月 2009

出版系列

名字IMPACT Conference 2009 International 3D IC Conference - Proceedings

Conference

ConferenceIMPACT Conference 2009 International 3D IC Conference
國家/地區Taiwan
城市Taipei
期間21/10/0923/10/09

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