@inproceedings{176e37b9dea34844b77d2113bbd37035,
title = "Fabrication of Highly (111)-oriented Nanotwinned Cu in Fine-pitch Vias for Cu/SiO2Hybrid Bonding",
abstract = "Nanotwinned Cu (NT-Cu) with highly (111)-oriented surface is beneficial to achieve low temperature Cu-Cu bonding. Nonetheless, it is difficult to deposit NT-Cu in Cu/SiO2 in small damascene vias. To overcome the restrict of the sidewall effect that may reduce surface (111) ratio of the vias, an optimized electrodeposition (ECD) approach was carried out. By tuning the electroplating temperatures and waveforms, we can successfully deposit NT-Cu into fine-pitch Cu/SiO2 vias. A bottom-up growing mode of NT-Cu can effectively reduce sidewall effect. Surface (111) ratio exceeds 80% and 55% for 8-μm and 2-μm Cu/SiO2 vias in diameter, respectively. Moreover, a theoretical model of predicting (111) ratio in small Cu/SiO2 vias based on the optimized ECD approach was proposed.",
keywords = "Cu hybrid bonding, Cu/SiOdamascene process, Highly (111)-oriented nanotwinned Cu, three-dimensional integrated circuit, ultra-fine pitch packaging technology",
author = "Yang, {Shih Chi} and Ong, {Jia Juen} and Tran, {Dinh Phuc} and Chiu, {Wei Lan} and Lee, {Ou Hsing} and Chiang, {Chia Wen} and Chang, {Hsiang Hung} and Wang, {Chin Hung} and Chih Chen",
note = "Publisher Copyright: {\textcopyright} 2023 Japan Institute of Electronics Packaging.; 22nd International Conference on Electronics Packaging, ICEP 2023 ; Conference date: 19-04-2023 Through 22-04-2023",
year = "2023",
doi = "10.23919/ICEP58572.2023.10129678",
language = "English",
series = "2023 International Conference on Electronics Packaging, ICEP 2023",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
pages = "13--14",
booktitle = "2023 International Conference on Electronics Packaging, ICEP 2023",
address = "美國",
}