TY - GEN
T1 - Fabrication of Biodegradable Soft Tissue-Mimicked Microelectrode Arrays for Implanted Neural Interfacing
AU - Huang, Wei Chen
AU - Lei, Wan Lou
AU - Peng, Chih Wei
N1 - Publisher Copyright:
© 2023 IEEE.
PY - 2023
Y1 - 2023
N2 - This paper reports a method to fabricate biodegradable, adhesive and soft tissue-compliant microelectrode arrays (MEAs). MEAs composed of polylactic acid (PLA) biodegradable insulation layers and Pt/PLA hybrid electrodes can be fabricated in a batch by photolithography with a tunable photoresist/developer composition. The coordinated sacrificial layer dissolution and interfacial adhesion driven by an adhesive hydrogel enable directly transfer printing Pt-PLA MEAs stacks. This integrated process will allow, for first time, the batch production of implanted hydrogel MEAs composed of metal/organic composites as conformal electrodes and fully biodegradable insulation layers to show significantly lower impedance (0.1-2.5 kΩ) at 1 kHz as compared with those reported from most literatures. This device enables the success of both in-vivo site-specific neural stimulation and recording.
AB - This paper reports a method to fabricate biodegradable, adhesive and soft tissue-compliant microelectrode arrays (MEAs). MEAs composed of polylactic acid (PLA) biodegradable insulation layers and Pt/PLA hybrid electrodes can be fabricated in a batch by photolithography with a tunable photoresist/developer composition. The coordinated sacrificial layer dissolution and interfacial adhesion driven by an adhesive hydrogel enable directly transfer printing Pt-PLA MEAs stacks. This integrated process will allow, for first time, the batch production of implanted hydrogel MEAs composed of metal/organic composites as conformal electrodes and fully biodegradable insulation layers to show significantly lower impedance (0.1-2.5 kΩ) at 1 kHz as compared with those reported from most literatures. This device enables the success of both in-vivo site-specific neural stimulation and recording.
KW - Biodegradable electronics
KW - Hydrogel electronics
KW - Microelectrode arrays
KW - Neural interfaces
KW - Platinum
KW - Polylactic acid (PLA)
KW - Transfer printing
UR - http://www.scopus.com/inward/record.url?scp=85149820596&partnerID=8YFLogxK
U2 - 10.1109/MEMS49605.2023.10052266
DO - 10.1109/MEMS49605.2023.10052266
M3 - Conference contribution
AN - SCOPUS:85149820596
T3 - Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
SP - 392
EP - 395
BT - 2023 IEEE 36th International Conference on Micro Electro Mechanical Systems, MEMS 2023
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 36th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2023
Y2 - 15 January 2023 through 19 January 2023
ER -