TY - GEN
T1 - Fabrication of a transparent structured superomniphobic surface using a multiple partial expose method
AU - Lee, Meng Shiue
AU - Wu, Po Han
AU - Hsu, Wen-Syang
N1 - Publisher Copyright:
© 2017 IEEE.
PY - 2017/2/23
Y1 - 2017/2/23
N2 - A novel approach which uses a multiple partial exposure method to fabricate a transparent structured superomniphobic surface with doubly re-entrant structures by using negative thick photoresist SU-8 as the material is proposed. By using gray-tone lithography, the doubly re-entrant structures can be formed only via a standard lithography process. The gray-tone lithography for fabricating the doubly re-entrant structures is achieved by depositing three appropriate thicknesses of Ti film on glass substrate that acts as the gray-tone mask. The proposed transparent surface with the doubly re-entrant structures successful suspend all the tested liquid even the completely wetting liquid, such as silicon oil with the surface tension of 20.9 mN/m. This approach provides a simple, flexible and low-cost solution for fabricating superomniphobic surface, and it also has the potential to integrate with either flexible or nonflexible substrate for different applications.
AB - A novel approach which uses a multiple partial exposure method to fabricate a transparent structured superomniphobic surface with doubly re-entrant structures by using negative thick photoresist SU-8 as the material is proposed. By using gray-tone lithography, the doubly re-entrant structures can be formed only via a standard lithography process. The gray-tone lithography for fabricating the doubly re-entrant structures is achieved by depositing three appropriate thicknesses of Ti film on glass substrate that acts as the gray-tone mask. The proposed transparent surface with the doubly re-entrant structures successful suspend all the tested liquid even the completely wetting liquid, such as silicon oil with the surface tension of 20.9 mN/m. This approach provides a simple, flexible and low-cost solution for fabricating superomniphobic surface, and it also has the potential to integrate with either flexible or nonflexible substrate for different applications.
UR - http://www.scopus.com/inward/record.url?scp=85015783500&partnerID=8YFLogxK
U2 - 10.1109/MEMSYS.2017.7863661
DO - 10.1109/MEMSYS.2017.7863661
M3 - Conference contribution
AN - SCOPUS:85015783500
T3 - Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
SP - 1314
EP - 1317
BT - 2017 IEEE 30th International Conference on Micro Electro Mechanical Systems, MEMS 2017
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 30th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2017
Y2 - 22 January 2017 through 26 January 2017
ER -