TY - JOUR
T1 - Fabrication and characterization of surface CMUT with a bossed membrane
AU - Mengli, Wang
AU - Jingkuang, Chen
AU - Xiaoyang, Cheng
AU - Chuan, Li
AU - Xueyuan, Liu
PY - 2008
Y1 - 2008
N2 - This paper describes the fabrication and characterization of surface-micromachined capacitive ultrasonic transducers with a bossed membrane. The boss was formed using 3μm thick deposited tetraethoxysilane (TEOS) oxide on top of a suspended polysilicon membrane. This same oxide layer was also used to seal the release holes along the peripheral of the polysilicon membrane. No extra mask or processing step in addition to that used for fabricating planar-membrane capacitive micromachined ultrasonic transducer (CMUT) is needed for the addition of a boss on the polysilicon membrane. It was found from device characterization that a bossed device shifted the center frequency to a higher value, improved the fractional bandwidth in transmission mode, increased the receiver sensitivity, and augmented the electromechanical coupling efficiency compared to their planar-membrane counterpart with the same membrane diameter.
AB - This paper describes the fabrication and characterization of surface-micromachined capacitive ultrasonic transducers with a bossed membrane. The boss was formed using 3μm thick deposited tetraethoxysilane (TEOS) oxide on top of a suspended polysilicon membrane. This same oxide layer was also used to seal the release holes along the peripheral of the polysilicon membrane. No extra mask or processing step in addition to that used for fabricating planar-membrane capacitive micromachined ultrasonic transducer (CMUT) is needed for the addition of a boss on the polysilicon membrane. It was found from device characterization that a bossed device shifted the center frequency to a higher value, improved the fractional bandwidth in transmission mode, increased the receiver sensitivity, and augmented the electromechanical coupling efficiency compared to their planar-membrane counterpart with the same membrane diameter.
UR - http://www.scopus.com/inward/record.url?scp=67649353060&partnerID=8YFLogxK
U2 - 10.1109/ULTSYM.2008.0097
DO - 10.1109/ULTSYM.2008.0097
M3 - Conference article
AN - SCOPUS:67649353060
SN - 1051-0117
SP - 394
EP - 397
JO - Proceedings of the IEEE Ultrasonics Symposium
JF - Proceedings of the IEEE Ultrasonics Symposium
M1 - 4803574
T2 - 2008 IEEE International Ultrasonics Symposium, IUS 2008
Y2 - 2 November 2008 through 5 November 2008
ER -