Fabricating and characterizing oblique polymer structures by electron beam writing on resist-coated SiO2 wafers

Fu-Hsiang Ko*, Jem Kun Chen, Feng Chih Chang

*此作品的通信作者

研究成果: Article同行評審

7 引文 斯高帕斯(Scopus)

摘要

We have successfully fabricated SU-8 materials having oblique structures by a new electron beam technology. We studied the contrast, sensitivity, etching, and thermal properties of SU-8, PMMA, and KrF resists to evaluate their suitability for the fabrication of oblique structures. Among these resists, SU-8 revealed the lowest contrast ratio, highest throughput, and best thermal stability, and so it became the candidate material for patterning the oblique structures. The technique we have developed involves five regional exposures of a thick SU-8 resist layer with various electron beam dosages. Furthermore, we discuss the surface morphology, reaction mechanism, and hydrophobicity after subjecting the SU-8 resist to a series of plasma treatments. The formation of surface nano-nodules during oxygen plasma treatment explains the surface hydrophobicity. We have carefully evaluated the effects of the electron beam writing dose and the design of the exposure area with respect to the inclined angle of the fabricated structure.

原文English
頁(從 - 到)1132-1137
頁數6
期刊Microelectronic Engineering
83
發行號4-9 SPEC. ISS.
DOIs
出版狀態Published - 4月 2006

指紋

深入研究「Fabricating and characterizing oblique polymer structures by electron beam writing on resist-coated SiO2 wafers」主題。共同形成了獨特的指紋。

引用此