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Experimental study of coefficient of thermal expansion of aligned graphite thermal interface materials
Hsiu Hung Chen, Yuan Zhao, Chung-Lung Chen
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機械工程學系
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引文 斯高帕斯（Scopus）
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深入研究「Experimental study of coefficient of thermal expansion of aligned graphite thermal interface materials」主題。共同形成了獨特的指紋。
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Keyphrases
Graphite
100%
Coefficient of Thermal Expansion
100%
Thermal Interface Materials
100%
Carbon Nanotubes
12%
Graphene
12%
Thermal Conductivity
12%
Temperature Range
12%
Bonding Material
12%
Carbon Materials
12%
High Power
12%
Semiconductor Materials
12%
Substrate Material
12%
Microelectronics
12%
Interface Design
12%
Interface Region
12%
Thermal Cycling
12%
Thermal Expansion Mismatch
12%
Matching Features
12%
Sn Solder
12%
Measuring System
12%
Allotropes
12%
Micro-nano
12%
Interface Material
12%
Thermal Interface
12%
Unique Coefficient
12%
Optical Coefficients
12%
Nano-thermal Interface Materials
12%
Engineering
Coefficient of Thermal Expansion
100%
Material Interface
100%
Bonding Material
12%
Nanoscale
12%
Thermal Conductivity
12%
Temperature Range
12%
Graphene
12%
Microelectronics
12%
Carbon Nanotube
12%
Thermal Cycle
12%
Substrate Material
12%
Carbon-Based Material
12%
Semiconductor Material
12%
Material Science
Thermal Expansion
100%
Interface (Material)
100%
Carbon Nanotube
12%
Graphene
12%
Silicon
12%
Thermal Conductivity
12%
Semiconductor Material
12%
Tin
12%
Carbon-Based Material
12%