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Experimental study of coefficient of thermal expansion of aligned graphite thermal interface materials
Hsiu Hung Chen, Yuan Zhao, Chung-Lung Chen
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機械工程學系
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深入研究「Experimental study of coefficient of thermal expansion of aligned graphite thermal interface materials」主題。共同形成了獨特的指紋。
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Physics & Astronomy
thermal expansion
81%
graphite
80%
coefficients
50%
solders
15%
microelectronics
13%
fillers
13%
tin
12%
carbon nanotubes
11%
industries
11%
graphene
10%
adjusting
10%
thermal conductivity
10%
cycles
8%
carbon
8%
products
8%
silicon
7%
temperature
3%
Engineering & Materials Science
Thermal expansion
95%
Graphite
93%
Hot Temperature
45%
Graphene
12%
Tin
12%
Microelectronics
11%
Carbon nanotubes
11%
Soldering alloys
10%
Fillers
9%
Thermal conductivity
9%
Semiconductor materials
9%
Silicon
8%
Carbon
7%
Substrates
7%
Fatigue of materials
7%
Industry
4%
Temperature
4%
Chemical Compounds
Thermal Expansion
100%
Graphite
69%
Solder
19%
Microelectronics
17%
Thermal Conductivity
14%
Filler
13%
Semiconductor
11%
Industry
11%
Carbon Nanotube
11%
Graphene
11%