Evaluation on ESD robustness of LTPS diode and TFT device by Transmission Line Pulsing (TLP) technique

Ming-Dou Ker, Tang Kui Tseng, Sheng Chieh Yang, An Shih, Yaw Ming Tsai

    研究成果: Conference contribution同行評審

    3 引文 斯高帕斯(Scopus)

    摘要

    ESD robustness of Low Temperature Poly-Si (LTPS) diodes and TFT devices has been investigated in this paper. By using the Transmission Line Pulsing (TLP) techniques, the lt2 (secondary breakdown current) of LTPS diodes and TFT devices were measured. To evaluate the ESD robustness of components for ESD protection, the shifts of breakdown voltage and cut-in voltage of LTPS diode and TFT devices after TLP stress are considered into failure threshold judgment. From the experimental results, It2 of LTPS diodes under forward-biased stress is better than that of LTPS TFT devices. Furthermore, the It2 of LTPS TFT devices under reversebiased stress is more robust than it under forward-biased stress. Such investigation results can help us to design a successful ESD protection for the circuits on glass.

    原文English
    主出版物標題VLSI 2003 - 2003 20th International Symposium on VLSI Technology, Systems and Applications, Proceedings
    發行者Institute of Electrical and Electronics Engineers Inc.
    頁面88-91
    頁數4
    ISBN(電子)0780377656
    DOIs
    出版狀態Published - 1 1月 2003
    事件20th International Symposium on VLSI Technology, Systems and Applications, VLSI 2003 - Hsinchu, Taiwan
    持續時間: 6 10月 20038 10月 2003

    出版系列

    名字International Symposium on VLSI Technology, Systems, and Applications, Proceedings
    2003-January
    ISSN(列印)1930-8868

    Conference

    Conference20th International Symposium on VLSI Technology, Systems and Applications, VLSI 2003
    國家/地區Taiwan
    城市Hsinchu
    期間6/10/038/10/03

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