Estimating the Process Variation Effects of Stacked Gate All Around Si Nanosheet CFETs Using Artificial Neural Network Modeling Framework

Rajat Butola, Yiming Li*, Sekhar Reddy Kola, Min Hui Chuang, Chandni Akbar

*此作品的通信作者

研究成果: Conference contribution同行評審

2 引文 斯高帕斯(Scopus)

摘要

We for the first time report a novel machine learning (ML) approach to model the effects of varying process parameters on DC characteristics of stacked gate all around (GAA) Si nanosheet (NS) complementary-FETs (CFETs) using an artificial neural network (ANN) model. Process parameters that have predominant effects on device characteristics are considered and used as input features to the ANN model; and, their effects on DC characteristics are modeled. Major figures of merit (FoMs) are further extracted accurately from the transfer characteristics in much less computational time as compared to 3D device simulation. The performance of the ANN model is further evaluated using the coefficient of determination, R2-score, which is more than 96%. It shows that the ANN model successfully learned the information from the dataset; thus, the ANN model exhibits the competency in device modeling of emerging CFETs.

原文English
主出版物標題2022 IEEE 22nd International Conference on Nanotechnology, NANO 2022
發行者IEEE Computer Society
頁面170-173
頁數4
ISBN(電子)9781665452250
DOIs
出版狀態Published - 2022
事件22nd IEEE International Conference on Nanotechnology, NANO 2022 - Palma de Mallorca, Spain
持續時間: 4 7月 20228 7月 2022

出版系列

名字Proceedings of the IEEE Conference on Nanotechnology
2022-July
ISSN(列印)1944-9399
ISSN(電子)1944-9380

Conference

Conference22nd IEEE International Conference on Nanotechnology, NANO 2022
國家/地區Spain
城市Palma de Mallorca
期間4/07/228/07/22

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