ESD Protection Design with Low-Leakage Consideration for Silicon Chips of IoT Applications

Ming-Dou Ker, Chun Yu Lin, Yi Han Wu, Wen Tai Wang

研究成果: Conference contribution同行評審

2 引文 斯高帕斯(Scopus)

摘要

On-chip electrostatic discharge (ESD) protection design with low-leakage consideration for the silicon chips of IoT applications is presented. The proposed ESD protection design uses the fast turn-on silicon-controlled rectifier (SCR) device to implement the power-rail ESD clamp circuit. Experimental results verified in TSMC 28nm CMOS process have shown that the proposed design has advantages of low leakage current (2∼3nA), low trigger voltage (∼2V), high ESD robustness (>8kV), and free to latchup issue.

原文English
主出版物標題2017 IEEE 7th Annual International Conference on CYBER Technology in Automation, Control, and Intelligent Systems, CYBER 2017
發行者Institute of Electrical and Electronics Engineers Inc.
頁面1496-1499
頁數4
ISBN(列印)9781538604892
DOIs
出版狀態Published - 24 8月 2018
事件7th IEEE Annual International Conference on CYBER Technology in Automation, Control, and Intelligent Systems, CYBER 2017 - Honolulu, United States
持續時間: 31 7月 20174 8月 2017

出版系列

名字2017 IEEE 7th Annual International Conference on CYBER Technology in Automation, Control, and Intelligent Systems, CYBER 2017

Conference

Conference7th IEEE Annual International Conference on CYBER Technology in Automation, Control, and Intelligent Systems, CYBER 2017
國家/地區United States
城市Honolulu
期間31/07/174/08/17

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