ESD protection design on analog pin with very low input capacitance for RF or current-mode applications

Ming-Dou Ker, Tung Yang Chen, Chung-Yu Wu, Hun Hsien Chang

研究成果: Conference contribution同行評審

4 引文 斯高帕斯(Scopus)

摘要

An ESD design is proposed to solve the ESD protection challenge to the analog pins for high-frequency or current-mode applications. By including an efficient power-rails clamp circuit into the analog I/O pin, the device dimension (W/L) of ESD clamp devices in the analog ESD protection circuit can be reduced to only 50/0.5 (μm/μm) in a 0.35-μm silicided CMOS process, but it can sustain the HBM (MM) ESD level of up to 6 kV (400 V). With such smaller device dimensions, the input capacitance of this analog ESD protection circuit can be significantly reduced to only ∼1.0 pF (including the bond pad capacitance) for high-frequency applications.

原文English
主出版物標題Proceedings - 12th Annual IEEE International ASIC/SOC Conference
發行者Institute of Electrical and Electronics Engineers Inc.
頁面352-356
頁數5
ISBN(電子)0780356322, 9780780356320
DOIs
出版狀態Published - 1 1月 1999
事件12th Annual IEEE International ASIC/SOC Conference - Washington, United States
持續時間: 15 9月 199918 9月 1999

出版系列

名字Proceedings - 12th Annual IEEE International ASIC/SOC Conference

Conference

Conference12th Annual IEEE International ASIC/SOC Conference
國家/地區United States
城市Washington
期間15/09/9918/09/99

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