ESD protection design for high-speed applications in CMOS technology

Jie Ting Chen, Chun Yu Lin, Rong Kun Chang, Ming Dou Ker, Tzu Chien Tzeng, Tzu Chiang Lin

研究成果: Conference contribution同行評審

4 引文 斯高帕斯(Scopus)

摘要

To prevent from electrostatic discharge (ESD) damages, the ESD protection design must be added on chip. The ESD protection design with low parasitic capacitance is needed for high-speed applications. In this work, an ESD protection design realized by stacked diodes with embedded siliconcontrolled rectifier was proposed. Verified in silicon chip, the proposed ESD protection design with lower parasitic capacitance and higher ESD robustness was more suitable for high-speed ESD protection in CMOS technology.

原文English
主出版物標題2016 IEEE 59th International Midwest Symposium on Circuits and Systems, MWSCAS 2016
發行者Institute of Electrical and Electronics Engineers Inc.
ISBN(電子)9781509009169
DOIs
出版狀態Published - 2 7月 2016
事件59th IEEE International Midwest Symposium on Circuits and Systems, MWSCAS 2016 - Abu Dhabi, United Arab Emirates
持續時間: 16 10月 201619 10月 2016

出版系列

名字Midwest Symposium on Circuits and Systems
0
ISSN(列印)1548-3746

Conference

Conference59th IEEE International Midwest Symposium on Circuits and Systems, MWSCAS 2016
國家/地區United Arab Emirates
城市Abu Dhabi
期間16/10/1619/10/16

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