TY - JOUR
T1 - Erratum
T2 - 3D-printed microelectronics for integrated circuitry and passive wireless sensors (Microsystems & Nanoengineering, (2015), 1, 15013, 10.1038/micronano.2015.13)
AU - Wu, Sung Yueh
AU - Yang, Chen
AU - Hsu, Wen-Syang
AU - Lin, Liwei
N1 - Publisher Copyright:
© 2015, Nature Publishing Group. All rights reserved.
PY - 2015
Y1 - 2015
N2 - Microsystems & Nanoengineering (2015) 1, 15013; doi: 10.1038/micronano.2015.13; Published online: 20 July 2015 Since the publication of this article, the authors would like to make two corrections in the third(last) paragraph of “Design and Fabrication” section as follows: 1 Replace “fused deposition modeling technology” with “multi-jet modeling (MJM)”; 2 The company information of “ProJet HD 3000 printer, Hewlett-Packard Company, Palo Alto, CA, USA” should be replaced with “ProJet HD 3000 printer, 3D Systems Inc., Rock Hill, SC, USA”. We apologize for any inconvenience may have caused.
AB - Microsystems & Nanoengineering (2015) 1, 15013; doi: 10.1038/micronano.2015.13; Published online: 20 July 2015 Since the publication of this article, the authors would like to make two corrections in the third(last) paragraph of “Design and Fabrication” section as follows: 1 Replace “fused deposition modeling technology” with “multi-jet modeling (MJM)”; 2 The company information of “ProJet HD 3000 printer, Hewlett-Packard Company, Palo Alto, CA, USA” should be replaced with “ProJet HD 3000 printer, 3D Systems Inc., Rock Hill, SC, USA”. We apologize for any inconvenience may have caused.
UR - http://www.scopus.com/inward/record.url?scp=85060339345&partnerID=8YFLogxK
U2 - 10.1038/micronano.2015.36
DO - 10.1038/micronano.2015.36
M3 - Comment/debate
AN - SCOPUS:85060339345
SN - 2055-7434
VL - 1
JO - Microsystems and Nanoengineering
JF - Microsystems and Nanoengineering
M1 - 15036
ER -