Keyphrases
Self-crosslinking
100%
Dielectric Properties
100%
Thermally Stable
100%
Polyimide
100%
Mechanical Properties
100%
Dianhydride
100%
Bicyclol
100%
Polyimide Film
25%
Crosslinked Polyimide
25%
Polymer Chain
16%
Network Structure
16%
Coefficient of Thermal Expansion
16%
Cross-linking Reaction
16%
Polyimide Materials
16%
Young's Modulus
8%
Integrated Circuits
8%
GHz Frequency
8%
Tensile Strength
8%
Dielectric Loss
8%
Double Bond
8%
Dielectric Constant
8%
Radical Reactions
8%
Triazine
8%
Glass Transition Temperature
8%
Thermal Properties
8%
Flexible Display
8%
4,4′-oxydianiline
8%
Promising Strategies
8%
Free Volume
8%
Cyclobutane
8%
Thermomechanical Properties
8%
High Tensile Strength
8%
Crosslinking Agent
8%
Microelectronic Circuits
8%
Molecular Dipole Moment
8%
Non-cross-linked
8%
Tetracarboxylic Acid Dianhydride
8%
Cross-linking Monomer
8%
Chemistry
Monomer
100%
Dielectric Properties
100%
Crosslinking
80%
Polymer Chain
40%
Tensile Strength
40%
formation
40%
Thermal Expansion
40%
Double Bond
20%
Free Radical Reactions
20%
Dipole Moment
20%
Dielectric Constant
20%
Glass Transition Temperature
20%
Cyclobutane
20%
1,3,5-triazine
20%
Tetracarboxylic Acid
20%
Free Volume
20%
Percent Reduction
20%
Dielectric Loss
20%
Permittivity
20%
Microelectronics
20%
Material Science
Polyimide
100%
Dielectric Property
100%
Film
17%
Ultimate Tensile Strength
11%
Thermal Expansion
11%
Thermal Property
11%
Young's Modulus
5%
Electronic Circuit
5%
Permittivity
5%
Glass Transition Temperature
5%
Free Volume
5%
Dielectric Material
5%