TY - GEN
T1 - Enhancement on the bonding strength of Cu-Cu joints by 2 steps annealing
AU - Ong, Jia Juen
AU - Tu, King-Ning
AU - Chen, Chih
N1 - Publisher Copyright:
© 2020 IEEE.
Copyright:
Copyright 2020 Elsevier B.V., All rights reserved.
PY - 2020/10/21
Y1 - 2020/10/21
N2 - We investigate the contribution of shear strength by the bonding temperature and shear strength in highly <111> nano-twinned copper. The bonding process is implemented in two steps. The first step is to alight top die and bottom die by using the alignment marks in nitrogen ambient under thermal compression within 30 seconds and 10 seconds. Second step is to anneal the chips in argon ambient that in argon ambient by previous step. To analyze the positive effect of post annealing in the process, we apply shear test and four probes measurement to get the qualitative result in strength and electrical properties.
AB - We investigate the contribution of shear strength by the bonding temperature and shear strength in highly <111> nano-twinned copper. The bonding process is implemented in two steps. The first step is to alight top die and bottom die by using the alignment marks in nitrogen ambient under thermal compression within 30 seconds and 10 seconds. Second step is to anneal the chips in argon ambient that in argon ambient by previous step. To analyze the positive effect of post annealing in the process, we apply shear test and four probes measurement to get the qualitative result in strength and electrical properties.
UR - http://www.scopus.com/inward/record.url?scp=85098215177&partnerID=8YFLogxK
U2 - 10.1109/IMPACT50485.2020.9268584
DO - 10.1109/IMPACT50485.2020.9268584
M3 - Conference contribution
AN - SCOPUS:85098215177
T3 - Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT
SP - 79
EP - 81
BT - International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2020 and 22nd International Conference on Electronics Materials and Packaging, EMAP 2020 - Proceedings
PB - IEEE Computer Society
T2 - 15th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2020 and 22nd International Conference on Electronics Materials and Packaging, EMAP 2020
Y2 - 21 October 2020 through 23 October 2020
ER -