Enhanced flow boiling in manifold microchannels through integrating three-dimensional flow and hierarchical surface

Keyphrases

• Silicon Nanowires (SiNWs) 100%
• Three-dimensional Flow 100%
• Hierarchical Surface 100%
• Flow Surface 100%
• Manifold Microchannel 100%
• Enhanced Flow Boiling 100%
• Three-dimensional Hierarchical 100%
• Flow Instability 66%
• Flow Pattern 33%
• Embedded Devices 33%
• Silicon Substrate 33%
• Temperature Fluctuation 33%
• Deionized Water 33%
• Heat Transfer Performance 33%
• Mass Flux 33%
• Silicon-based 33%
• Reduced Pressure 33%
• Inlet Temperature 33%
• Wall Temperature 33%
• Heat Transfer Enhancement 33%
• Pressure Loss 33%
• Manifold Embedding 33%
• Two-phase Flow Boiling 33%
• Cover Glass 33%
• Effective Flow 33%
• Fluctuation Pattern 33%
• Maximum Heat Flux 33%
• Instability Control 33%
• Inlet Subcooling 33%
• Manifold Microchannel Heat Sink 33%
• Capillary-driven 33%
• Microchannel Device 33%
• Heating Element 33%
• Performance Pressure 33%
• Flow Boiling 33%
• Boiling Characteristics 33%

Engineering

• Microchannel 100%
• Dimensional Flow 100%
• Flow Instability 33%
• Experimental Result 16%
• Silicon Substrate 16%
• Flow Pattern 16%
• Temperature Fluctuation 16%
• Reduced Pressure 16%
• Inlet Temperature 16%
• Two-Phase Flow 16%
• Pressure Loss 16%
• Glass Cover 16%
• Maximum Heat Flux 16%
• Heating Element 16%
• Mass Transfer 16%
• Embedded Device 16%