Embossing of high-aspect-ratio-microstructures using sacrificial templates and fast surface heating

Chunmeng Lu, Mark Ming Cheng Cheng, Avraham Benatar, L. James Lee*

*此作品的通信作者

研究成果: Article同行評審

18 引文 斯高帕斯(Scopus)

摘要

A new embossing method based on sacrificial templates and fast surface heating was developed, in which the de-embossing step was avoided to prevent deformation or damage of polymer microstructures. The microstructures of interest have a high feature density, high aspect ratio, and/or undercuts. Soft lithography was used to prepare a water-soluble mold, using polyvinylpyrrolidone (PVP) in the hot embossing process. Arrays of microchannels and microgrids with an aspect ratio greater than five were replicated on poly(DL-lactide-co- glycolide) (PLGA). In conjunction with localized surface heating of the polymer surface by a laser/IR system, this technique was able to micromold high temperature polymers such as poly(methyl methacrylate) (PMMA) with high aspect ratios.

原文English
頁(從 - 到)830-840
頁數11
期刊Polymer Engineering and Science
47
發行號6
DOIs
出版狀態Published - 6月 2007

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