TY - CHAP
T1 - Embedded memory
AU - Wu, Chung-Yu
N1 - Publisher Copyright:
© 2003 by CRC Press LLC.
PY - 2003/1/1
Y1 - 2003/1/1
N2 - As CMOS technology progresses rapidly toward the deep submicron regime, the integration level, performance, and fabrication cost increase tremendously. Thus, low-integration, low-performance small circuits or systems chips designed using deep submicron CMOS technology are not cost-effective. Only high-performance system chips that integrate CPU (central processing unit), DSP (digital signal processing) processors or multimedia processors, memories, logic circuits, analog circuits, etc. can afford the deep submicron technology. Such system chips are called system-on-a-chip (SOC) or system-onsilicon (SOS).1,2 A typical example of SOC chips is shown in Fig. 4.1.
AB - As CMOS technology progresses rapidly toward the deep submicron regime, the integration level, performance, and fabrication cost increase tremendously. Thus, low-integration, low-performance small circuits or systems chips designed using deep submicron CMOS technology are not cost-effective. Only high-performance system chips that integrate CPU (central processing unit), DSP (digital signal processing) processors or multimedia processors, memories, logic circuits, analog circuits, etc. can afford the deep submicron technology. Such system chips are called system-on-a-chip (SOC) or system-onsilicon (SOS).1,2 A typical example of SOC chips is shown in Fig. 4.1.
UR - http://www.scopus.com/inward/record.url?scp=85055847869&partnerID=8YFLogxK
U2 - 10.1201/9780203010235
DO - 10.1201/9780203010235
M3 - Chapter
AN - SCOPUS:85055847869
SN - 0849317371
SN - 9780849317378
SP - 4-1-4-20
BT - Memory, Microprocessor, and ASIC
PB - CRC Press
ER -