Electromigration and Temperature Cycling Tests of Cu-Cu Joints Fabricated by Instant Copper Direct Bonding

  • Kai Cheng Shie
  • , Po Ning Hsu
  • , Yu Jin Li
  • , K. N. Tu
  • , Benson Tzu Hung Lin
  • , Chia Cheng Chang
  • , Chih Chen

研究成果: Conference contribution › 同行評審

16 引文 斯高帕斯（Scopus）

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Keyphrases

Engineering

Material Science