Electrodeposition of Ni-Cu alloys in an air and water stable room temperature ionic liquid

Ming Jay Deng*, Pei Chiung Lin, I. Wen Sun, P. O.Y.U. Chen, Jeng-Kuei Chang

*此作品的通信作者

研究成果: Article同行評審

15 引文 斯高帕斯(Scopus)

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Engineering & Materials Science

Chemical Compounds