Electrical Characteristics and Reliability of Wafer-on-Wafer (WOW) Bumpless Through-Silicon Via

Yi Chieh Tsai, Chia Hsuan Lee, Hsin Chi Chang, Jui Han Liu, Han Wen Hu, Hiroyuki Ito, Young Suk Kim, Takayuki Ohba, Kuan-Neng Chen

研究成果: Article › 同行評審

11 引文 斯高帕斯（Scopus）

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Keyphrases

Engineering

Material Science