Effects of NHβ-plasma nitridation on the electrical characterizations of low-fc hydrogen silsesquioxane with copper interconnects

Keyphrases

• Plasma Nitridation 100%
• Electrical Characterization 100%
• Copper Interconnect 100%
• Hydrogen Silsesquioxane 100%
• Plasma Treatment 33%
• NH3 Plasma 33%
• Capacitors 16%
• Electrical Characteristics 16%
• Mass Spectrometry Analysis 16%
• Leakage Current 16%
• Semiconductors 16%
• Dielectric Properties 16%
• Copper Diffusion 16%
• Secondary Ion Mass Spectrometry 16%
• NH3 Plasma Treatment 16%
• Thermal Stress 16%
• Characteristics Measurement 16%
• Diffusion Barrier Layer 16%
• Leakage Current Behavior 16%
• Copper Atom 16%
• Poole-Frenkel Conduction 16%
• Metal Insulation 16%
• High Field Conduction 16%
• Film Degradation 16%
• Poole-Frenkel Mechanism 16%

Material Science

• Nitriding 100%
• Silsesquioxane 100%
• Film 50%
• Electrical Property 16%
• Capacitor 16%
• Dielectric Property 16%
• Secondary Ion Mass Spectrometry 16%
• Thermal Stress 16%