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Effects of low tempersture NH3 treatment on HfO2/SiO2 stack gate dielectrics fabricated by MOCVD system
Wen Tai Lu
*
,
Chao-Hsin Chien
, Ying Chang Lin, Ming Jui Yang, Tiao Yuan Huang
*
此作品的通信作者
電子研究所
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Keyphrases
Metal-organic Chemical Vapor Deposition (MOCVD)
100%
Low Temperature
100%
Silica
100%
HfO2
100%
NH3 Treatment
100%
Stacked Gate Dielectric
100%
NH 3
75%
Post-deposition Annealing
50%
Oxide Thickness
50%
Annealing
25%
Annealing Temperature
25%
HfO2 Films
25%
Interfacial Layer
25%
Frequency Dispersion
25%
Trap Generation
25%
Gate Stack
25%
Gate Electrode
25%
Generation Rate
25%
TiN Gate
25%
Quantum Effects
25%
C-V Characteristics
25%
Post Deposition
25%
Characteristic Frequency
25%
High-temperature Nitridation
25%
Dielectric Breakdown Voltage
25%
Engineering
Low-Temperature
100%
Gate Dielectric
100%
Silicon Dioxide
100%
Oxide Thickness
50%
Dielectrics
25%
Annealing Temperature
25%
Breakdown Voltage
25%
Interfacial Layer
25%
Frequency Dispersion
25%
Gate Stack
25%
Gate Electrode
25%
Quantum Effect
25%
Characteristic Frequency
25%
Material Science
Oxide Compound
100%
Annealing
100%
Dielectric Material
100%
Film
50%
Nitriding
50%
Electrical Breakdown
50%