Effects of localized warpage and stress on chip-on-glass packaging: Induced light-leakage phenomenon in mid-sized TFT-LCD

Leu-Jih Perng*, Chin Cheng Chang, Alexander Chen, Mao Hsing Lin, Kun Feng Huang

*此作品的通信作者

研究成果: Article同行評審

7 引文 斯高帕斯(Scopus)

摘要

Mura defects become visible in a 13.3-in. TFT-LCD using chip-on-glass (COG) packaging when the thickness of the glass substrate is decreased from 0.5 to 0.3 mm. Mura, the non-uniform brightness in LCDs, is caused by COG packaging due to the mismatch of the coefficient of thermal expansion (CTE) and Young's modulus between the glass substrate and the IC-driver Si chips. In this paper, a 3-D finite-element-analysis (FEA) model, coupled with transient thermal analysis is first established to examine the warpage and stress behavior in the upper-glass-plate post-COG-package processing for identifying the root causes of the light-leakage phenomenon. Prior to that, the simulated warpage results are validated by surface-contour measurement. Data and modeling results show that a low bonding temperature together with a low modulus in novel ACF materials can effectively eliminate Mura. Besides, thinner silicon or a shorter length of Si chips as drivers offers enhanced reduction in the localized warpage, and thus can be a practical and low-cost solution for eliminating mura defects.

原文English
頁(從 - 到)28-36
頁數9
期刊Journal of the Society for Information Display
20
發行號1
DOIs
出版狀態Published - 1 一月 2012

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