Effects of H-2 plasma treatment on low dielectric constant methylsilsesquioxane

Keyphrases

• Low Dielectric Constant 100%
• Plasma Treatment 100%
• Leakage Current 20%
• Dielectric Properties 20%
• Copper Diffusion 20%
• Moisture Uptake 20%
• Dielectric Constant 20%
• Low-k Dielectric 20%
• Oxygen Plasma 20%
• Passivated 20%
• Cu Atoms 20%
• Time-to-treatment 20%
• Photoresist Stripping 20%
• Plasma Behavior 20%
• Hygroscopic Behavior 20%
• Inner Structure 20%
• Diffusion Resistance 20%
• Penetration Resistance 20%
• Moisture Exchange 20%

Material Science

• Film 100%
• Permittivity 100%
• Dielectric Property 33%