Effective strategy for porous organosilicate to suppress oxygen ashing damage

Po-Tsun Liu; T. C. Chang; Y. S. Mor; C. W. Chen; T. M. Tsai; C. J. Chu; Fu-Ming Pan; S. M. Szea

doi:10.1149/1.1445644

Effective strategy for porous organosilicate to suppress oxygen ashing damage

Po-Tsun Liu^*, T. C. Chang, Y. S. Mor, C. W. Chen, T. M. Tsai, C. J. Chu, Fu-Ming Pan, S. M. Szea

^*此作品的通信作者

研究成果: Article › 同行評審

25 引文斯高帕斯（Scopus）

摘要

Photoresist stripping with oxygen plasma ashing destroys numerous functional groups in porous organosilicate glasses (OSGs). This impact makes the porous OSG relatively hydrophilic and causes low-k dielectric degradation. To mitigate these issues, various strategies are investigated to enhance oxygen plasma resistance of the porous OSG. These include physical and chemical procedures. Both structural and electrical analyses are used to determine their efficiency. In addition, an optimum prescription that consists of H₂ plasma and chemical trimethylchlorosilane treatment is developed in this work. The enhancement of oxygen plasma resistance can provide the porous OSG for practical application in the multilevel interconnection.

原文	English
頁（從 - 到）	G11-G14
期刊	Electrochemical and Solid-State Letters
卷	5
發行號	3
DOIs	https://doi.org/10.1149/1.1445644
出版狀態	Published - 3月 2002

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abstract = "Photoresist stripping with oxygen plasma ashing destroys numerous functional groups in porous organosilicate glasses (OSGs). This impact makes the porous OSG relatively hydrophilic and causes low-k dielectric degradation. To mitigate these issues, various strategies are investigated to enhance oxygen plasma resistance of the porous OSG. These include physical and chemical procedures. Both structural and electrical analyses are used to determine their efficiency. In addition, an optimum prescription that consists of H2 plasma and chemical trimethylchlorosilane treatment is developed in this work. The enhancement of oxygen plasma resistance can provide the porous OSG for practical application in the multilevel interconnection.",

author = "Po-Tsun Liu and Chang, {T. C.} and Mor, {Y. S.} and Chen, {C. W.} and Tsai, {T. M.} and Chu, {C. J.} and Fu-Ming Pan and Szea, {S. M.}",

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AU - Liu, Po-Tsun

AU - Chang, T. C.

AU - Mor, Y. S.

AU - Chen, C. W.

AU - Tsai, T. M.

AU - Chu, C. J.

AU - Pan, Fu-Ming

AU - Szea, S. M.

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AB - Photoresist stripping with oxygen plasma ashing destroys numerous functional groups in porous organosilicate glasses (OSGs). This impact makes the porous OSG relatively hydrophilic and causes low-k dielectric degradation. To mitigate these issues, various strategies are investigated to enhance oxygen plasma resistance of the porous OSG. These include physical and chemical procedures. Both structural and electrical analyses are used to determine their efficiency. In addition, an optimum prescription that consists of H2 plasma and chemical trimethylchlorosilane treatment is developed in this work. The enhancement of oxygen plasma resistance can provide the porous OSG for practical application in the multilevel interconnection.

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JO - Electrochemical and Solid-State Letters

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ER -

Effective strategy for porous organosilicate to suppress oxygen ashing damage

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