Effective repair to ultra-low-k dielectric material (k∼2.0) by hexamethyldisilazane treatment

  • Y. S. Mor
  • , T. C. Chang*
  • , Po-Tsun Liu
  • , T. M. Tsai
  • , C. W. Chen
  • , S. T. Yan
  • , C. J. Chu
  • , W. F. Wu
  • , Fu-Ming Pan
  • , Water Lur
  • , S. M. Sze
  • *此作品的通信作者

研究成果: Conference article同行評審

90 引文 斯高帕斯(Scopus)

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Keyphrases

Material Science