Effective repair to ultra-low-k dielectric material (k∼2.0) by hexamethyldisilazane treatment
Y. S. Mor, T. C. Chang*, Po-Tsun Liu, T. M. Tsai, C. W. Chen, S. T. Yan, C. J. Chu, W. F. Wu, Fu-Ming Pan, Water Lur, S. M. Sze
*此作品的通信作者
研究成果: Conference article › 同行評審
90
引文
斯高帕斯（Scopus）