Effect of the thickness of nickel film interlayer on direct-bonded aluminum/alumina as substrate in high-power devices

Wei Che Chao, Chien Cheng Lin, Kun Lin Lin*

*此作品的通信作者

    研究成果: Article同行評審

    摘要

    Aluminum (Al) was successfully bonded with alumina (Al2O3) using Ni films of different thicknesses (3, 6, 12 μm) through electroplating and electroless plating processes after annealing at the relatively low melting point of Al. The microstructure, bonding area percentage, shear strength, and thermal conductivity of Al/Al2O3 joints were evaluated using scanning electron microscopy, scanning acoustic tomography (SAT), the ISO 13124 test, and the laser flash method respectively. No reaction layer was found at the interface of the Al/Al2O3 joint, and the Ni film diffused completely into Al to form an intermetallic compound, Al3Ni, in the Al foil. The amount and size of the Al3Ni phase in the Al foil increased gradually with the thickness of the Ni film. The samples with Ni deposited via electroplating had a higher shear stress and bonding area than the samples with Ni deposited via electroless plating. The Al/Al2O3 specimen with a 3-μm-thick Ni film interlayer deposited using electroplating had the highest shear strength (50.6 MPa), thermal conductivity (39.45 W/mK), and bonding area percentage (~99.97%); therefore, specimens produced under these conditions were considered suitable for use as a substrate in high-power devices.

    原文English
    頁(從 - 到)1-10
    頁數10
    期刊International Journal of Applied Ceramic Technology
    DOIs
    出版狀態Published - 2 一月 2021

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