Effect of passivation layer on the reliability of flexible a-Si:H TFTs

Yi Teh Chou*, Po-Tsun Liu, Shang Yao Tsai, Chih Yu Su, I. Hsuan Peng

*此作品的通信作者

研究成果: Conference contribution同行評審

摘要

We investigated the stability of a-Si:H TFTs under mechanical strain with and without silicon nitride (SiNx;H) passivation. The process temperature of these flexibledevice, including the passivation layer, was well-controlled below 200°C, and the substrate was using stainless steel foil. The strain stress was applied cylindrically parallel to the active channel path of TFTs. The stability measurement was performed by DC gate bias stress and lasted up to 10 4 seconds, By using electrical parameter fitting, the V th, metastability mechanism was dominated by state creation effect. Our result indicated the device with passivation layer was improved, and the V th had less variation under both outward and inward bending. By exerting 190°C post-annealing process after SiNx:H deposited, the V th was shifted left and the reliability of flexible TFTs became better than without post-annealing process. That's related to the passivating effect of hydrogen ion under passivation layer and post-annealing process.

原文English
主出版物標題ECS Transactions - Thin Film Transistors 9, TFT 9
頁面339-343
頁數5
版本9
DOIs
出版狀態Published - 1 12月 2008
事件Thin Film Transistors 9, TFT 9 - 214th ECS Meeting - Honolulu, HI, 美國
持續時間: 13 10月 200816 10月 2008

出版系列

名字ECS Transactions
號碼9
16
ISSN(列印)1938-5862
ISSN(電子)1938-6737

Conference

ConferenceThin Film Transistors 9, TFT 9 - 214th ECS Meeting
國家/地區美國
城市Honolulu, HI
期間13/10/0816/10/08

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