Effect of Nanotwin Boundary on the Cu-Cu Bonding

Tsan Feng Lu, Tung Yan Lai, Yi Yang Chu, Yew Chung Sermon Wu*

*此作品的通信作者

研究成果: Article同行評審

2 引文 斯高帕斯(Scopus)

摘要

Cu direct bonding has been achieved at 120 C by using (111)-oriented nanotwinned Cu because it has the fastest surface diffusivity. In this study, the effect of nanotwin boundary on the Cu bonding was investigated by using two types of (111)-oriented Cu films: sputtered 97% (111)-oriented Cu films and electroplated nano-twinned-Cu films. Artificial voids were introduced at bonded interfaces by bonding an etched-Cu sample to an unetched-Cu. The evolutions of interfacial voids were investigated at 150 C and 200 C. It was found that nanotwin boundary could enhance the transport of Cu atoms, thus enhance Cu-Cu direct bonding.

原文English
文章編號074001
頁數5
期刊ECS Journal of Solid State Science and Technology
10
發行號7
DOIs
出版狀態Published - 1 7月 2021

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