Double-sided <111>-oriented nanotwinned copper foils for thermal interface materials in high power electronics

Guan You Shen*, Chih Chen

*此作品的通信作者

研究成果: Conference contribution同行評審

摘要

Double-sided <111>-oriented nanotwinned copper foils with 99% highly <111> orientation and low roughness on both surfaces are fabricated for diffusion bonding. We succeed to use them to bond copper substrates and silicon substrates at 300 °C for 30 min with excellent bonding quality and bonding strength. With the high melting point, thermal conductivity, and bonding strength, the Cu foils show great potential for thermal interface materials in high power electronics.

原文English
主出版物標題2023 International Conference on Electronics Packaging, ICEP 2023
發行者Institute of Electrical and Electronics Engineers Inc.
頁面183-184
頁數2
ISBN(電子)9784991191152
DOIs
出版狀態Published - 2023
事件22nd International Conference on Electronics Packaging, ICEP 2023 - Kumamoto, Japan
持續時間: 19 4月 202322 4月 2023

出版系列

名字2023 International Conference on Electronics Packaging, ICEP 2023

Conference

Conference22nd International Conference on Electronics Packaging, ICEP 2023
國家/地區Japan
城市Kumamoto
期間19/04/2322/04/23

指紋

深入研究「Double-sided <111>-oriented nanotwinned copper foils for thermal interface materials in high power electronics」主題。共同形成了獨特的指紋。

引用此