TY - GEN
T1 - Double-sided <111>-oriented nanotwinned copper foils for thermal interface materials in high power electronics
AU - Shen, Guan You
AU - Chen, Chih
N1 - Publisher Copyright:
© 2023 Japan Institute of Electronics Packaging.
PY - 2023
Y1 - 2023
N2 - Double-sided <111>-oriented nanotwinned copper foils with 99% highly <111> orientation and low roughness on both surfaces are fabricated for diffusion bonding. We succeed to use them to bond copper substrates and silicon substrates at 300 °C for 30 min with excellent bonding quality and bonding strength. With the high melting point, thermal conductivity, and bonding strength, the Cu foils show great potential for thermal interface materials in high power electronics.
AB - Double-sided <111>-oriented nanotwinned copper foils with 99% highly <111> orientation and low roughness on both surfaces are fabricated for diffusion bonding. We succeed to use them to bond copper substrates and silicon substrates at 300 °C for 30 min with excellent bonding quality and bonding strength. With the high melting point, thermal conductivity, and bonding strength, the Cu foils show great potential for thermal interface materials in high power electronics.
KW - (111)-preferred oriented nanotwinned Cu
KW - high power device
KW - thermal interface materials
UR - http://www.scopus.com/inward/record.url?scp=85161835770&partnerID=8YFLogxK
U2 - 10.23919/ICEP58572.2023.10129769
DO - 10.23919/ICEP58572.2023.10129769
M3 - Conference contribution
AN - SCOPUS:85161835770
T3 - 2023 International Conference on Electronics Packaging, ICEP 2023
SP - 183
EP - 184
BT - 2023 International Conference on Electronics Packaging, ICEP 2023
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 22nd International Conference on Electronics Packaging, ICEP 2023
Y2 - 19 April 2023 through 22 April 2023
ER -