Dewetting of molten Sn on Au/Cu/Cr thin-film metallization

C. Y. Liu*, H. K. Kim, King-Ning Tu, P. A. Totta

*此作品的通信作者

研究成果: Article同行評審

42 引文 斯高帕斯(Scopus)

摘要

On Au/Cu/Cr thin film surface, a drop of molten Sn first spreads out to wet the surface, but it then pulls back to dewet. The latter is due to the spalling of Cu-Sn compounds and exposing the Cr surface to the molten Sn when all of the Cu film has been consumed by the wetting reaction. Dewetting is clearly undesirable for solder joints in electronic packaging; the phenomenon is presented here.

原文English
頁(從 - 到)4014-4016
頁數3
期刊Applied Physics Letters
69
發行號26
DOIs
出版狀態Published - 23 十二月 1996

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