TY - JOUR
T1 - Device challenges and opportunities
AU - Hu, Chen-Ming
PY - 2004/10/1
Y1 - 2004/10/1
N2 - CMOS technology is facing exciting opportunities and formidable challenges. They include mobility scaling to overcome the speed/power barrier, new gate-stack materials and/or new device structures to overcome the gate-length/leakage barrier, nonvolatile memory and universal memory to enlarge the market, and containment of costs. CMOS has much more to give in the next two decades, yet it is not too early, especially in universities, to start searching for not-CMOS-like circuit/system architectures that may require non-existing new devices but offer the promise of dramatic reduction in power and cost.
AB - CMOS technology is facing exciting opportunities and formidable challenges. They include mobility scaling to overcome the speed/power barrier, new gate-stack materials and/or new device structures to overcome the gate-length/leakage barrier, nonvolatile memory and universal memory to enlarge the market, and containment of costs. CMOS has much more to give in the next two decades, yet it is not too early, especially in universities, to start searching for not-CMOS-like circuit/system architectures that may require non-existing new devices but offer the promise of dramatic reduction in power and cost.
UR - http://www.scopus.com/inward/record.url?scp=4544324636&partnerID=8YFLogxK
U2 - 10.1109/VLSIT.2004.1345359
DO - 10.1109/VLSIT.2004.1345359
M3 - Conference article
AN - SCOPUS:4544324636
SN - 0743-1562
SP - 4
EP - 5
JO - Digest of Technical Papers - Symposium on VLSI Technology
JF - Digest of Technical Papers - Symposium on VLSI Technology
T2 - 2004 Symposium on VLSI Technology - Digest of Technical Papers
Y2 - 15 June 2004 through 17 June 2004
ER -