Development of three dimensional neural sensing device by stacking method

Jin-Chern Chiou*, Chih Wei Chang

*此作品的通信作者

研究成果: Conference contribution同行評審

1 引文 斯高帕斯(Scopus)

摘要

This study reports a stacking method for assembling a 3-D microprobe array. To date, various 3D array structures have been reported with complex assembly steps, vertical interconnection for 3-D signal transmission which may suffer from low structure strength and large implantable opening. By applying the proposed stacking method, the previous problems were no longer existed. Also, ASIC chips could be substituted for the spacers in the stacked arrays achieving system integration, design flexibility and volume usage efficiency. To avoid overflow of the adhesive fluid during assembly, an anti-overflow design which made use of capillary action force was applied in the stacking method as well. Presented stacking procedure consumes only 35 minutes in average for a 4 x 4 3D microprobe array without requiring specially made assembly tools. The advantages of the proposed stacking method for 3D array assembly include simplified assembly process, high structure strength, smaller opening area and integration ability with active circuits. This stacking assembly technique allows an alternative method to create 3-D structures from planar components.

原文English
主出版物標題IEEE Sensors 2010 Conference, SENSORS 2010
頁面2342-2345
頁數4
DOIs
出版狀態Published - 1 12月 2010
事件9th IEEE Sensors Conference 2010, SENSORS 2010 - Waikoloa, HI, United States
持續時間: 1 11月 20104 11月 2010

出版系列

名字Proceedings of IEEE Sensors

Conference

Conference9th IEEE Sensors Conference 2010, SENSORS 2010
國家/地區United States
城市Waikoloa, HI
期間1/11/104/11/10

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