Development of Metal Bonding for Passive Matrix Micro-LED Display Applications

Ray-Hua Horng; Yi Fan Chen; Chi Han Wang; Hung Yu Chena

doi:10.1109/LED.2021.3078778

Development of Metal Bonding for Passive Matrix Micro-LED Display Applications

Ray-Hua Horng, Yi Fan Chen, Chi Han Wang, Hung Yu Chena

研究成果: Article › 同行評審

18 引文斯高帕斯（Scopus）

摘要

Recently, there are many breakthroughs of display in the high resolution and vivid colors for applications in virtual/augmented reality. In this study, we have successfully developed a 64 × 32 array inline structure of a micro-LED (μLED) display by metal bonding an LED array with a glass circuit for connecting a passive matrix IC driver. The dimension of each μLED was 100 μm × 100 μm. After bonding, the optoelectronic characteristics were measured to evaluate the best process. By the circuit fabricated on glass and by using a bonding design, we were able to increase the usage ratio of the epitaxy layer and reduce the cost of the μLED display. Au.In metal bonding demonstrated an excellent bonding result that can withstand a shear force up to 12.58 kg after being reinforced with UV glue. The output power of the display was 61 mW under 120 mA (@1.9 V) current injection to the whole display and the wall plug efficiency is 26.75.

原文	English
文章編號	9427202
頁（從 - 到）	1017-1020
頁數	4
期刊	Ieee Electron Device Letters
卷	42
發行號	7
DOIs	https://doi.org/10.1109/LED.2021.3078778
出版狀態	Published - 7月 2021

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10.1109/LED.2021.3078778

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title = "Development of Metal Bonding for Passive Matrix Micro-LED Display Applications",

abstract = "Recently, there are many breakthroughs of display in the high resolution and vivid colors for applications in virtual/augmented reality. In this study, we have successfully developed a 64 × 32 array inline structure of a micro-LED (μLED) display by metal bonding an LED array with a glass circuit for connecting a passive matrix IC driver. The dimension of each μLED was 100 μm × 100 μm. After bonding, the optoelectronic characteristics were measured to evaluate the best process. By the circuit fabricated on glass and by using a bonding design, we were able to increase the usage ratio of the epitaxy layer and reduce the cost of the μLED display. Au.In metal bonding demonstrated an excellent bonding result that can withstand a shear force up to 12.58 kg after being reinforced with UV glue. The output power of the display was 61 mW under 120 mA (@1.9 V) current injection to the whole display and the wall plug efficiency is 26.75.",

keywords = "Bonding, Current measurement, display, Glass, Integrated circuits, Light emitting diodes, metal bonding, Metals, Micro-LED, Substrates, wall plug efficiency",

author = "Ray-Hua Horng and Chen, {Yi Fan} and Wang, {Chi Han} and Chena, {Hung Yu}",

note = "Publisher Copyright: IEEE",

year = "2021",

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doi = "10.1109/LED.2021.3078778",

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AU - Horng, Ray-Hua

AU - Chen, Yi Fan

AU - Wang, Chi Han

AU - Chena, Hung Yu

N1 - Publisher Copyright: IEEE

PY - 2021/7

Y1 - 2021/7

N2 - Recently, there are many breakthroughs of display in the high resolution and vivid colors for applications in virtual/augmented reality. In this study, we have successfully developed a 64 × 32 array inline structure of a micro-LED (μLED) display by metal bonding an LED array with a glass circuit for connecting a passive matrix IC driver. The dimension of each μLED was 100 μm × 100 μm. After bonding, the optoelectronic characteristics were measured to evaluate the best process. By the circuit fabricated on glass and by using a bonding design, we were able to increase the usage ratio of the epitaxy layer and reduce the cost of the μLED display. Au.In metal bonding demonstrated an excellent bonding result that can withstand a shear force up to 12.58 kg after being reinforced with UV glue. The output power of the display was 61 mW under 120 mA (@1.9 V) current injection to the whole display and the wall plug efficiency is 26.75.

AB - Recently, there are many breakthroughs of display in the high resolution and vivid colors for applications in virtual/augmented reality. In this study, we have successfully developed a 64 × 32 array inline structure of a micro-LED (μLED) display by metal bonding an LED array with a glass circuit for connecting a passive matrix IC driver. The dimension of each μLED was 100 μm × 100 μm. After bonding, the optoelectronic characteristics were measured to evaluate the best process. By the circuit fabricated on glass and by using a bonding design, we were able to increase the usage ratio of the epitaxy layer and reduce the cost of the μLED display. Au.In metal bonding demonstrated an excellent bonding result that can withstand a shear force up to 12.58 kg after being reinforced with UV glue. The output power of the display was 61 mW under 120 mA (@1.9 V) current injection to the whole display and the wall plug efficiency is 26.75.

KW - Bonding

KW - Current measurement

KW - display

KW - Glass

KW - Integrated circuits

KW - Light emitting diodes

KW - metal bonding

KW - Metals

KW - Micro-LED

KW - Substrates

KW - wall plug efficiency

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Development of Metal Bonding for Passive Matrix Micro-LED Display Applications

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