Development of Metal Bonding for Passive Matrix Micro-LED Display Applications

Ray Hua Horng, Yi Fan Chen, Chi Han Wang, Hung Yu Chena

    研究成果: Article同行評審

    摘要

    Recently, there are many breakthroughs of display in the high resolution and vivid colors for applications in virtual/augmented reality. In this study, we have successfully developed a 64 × 32 array inline structure of a micro-LED (μLED) display by metal bonding an LED array with a glass circuit for connecting a passive matrix IC driver. The dimension of each μLED was 100 μm × 100 μm. After bonding, the optoelectronic characteristics were measured to evaluate the best process. By the circuit fabricated on glass and by using a bonding design, we were able to increase the usage ratio of the epitaxy layer and reduce the cost of the μLED display. Au.In metal bonding demonstrated an excellent bonding result that can withstand a shear force up to 12.58 kg after being reinforced with UV glue. The output power of the display was 61 mW under 120 mA (@1.9 V) current injection to the whole display and the wall plug efficiency is 26.75.

    原文English
    期刊Ieee Electron Device Letters
    DOIs
    出版狀態Accepted/In press - 2021

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