Development of low-temperature bonding platform using ultra-thin area selective deposition for heterogeneous integration

  • Mu Ping Hsu
  • , Chi Yu Chen
  • , Hsin Chi Chang
  • , Zhong Jie Hong
  • , Ming Wei Weng
  • , Kuan Neng Chen

研究成果: Article › 同行評審

15 引文 斯高帕斯（Scopus）

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Keyphrases

Engineering

Material Science