Development of anti-wear and anti-bacteria TaN-(Ag,Cu) thin films - A review

J. H. Hsieh*, C. H. Chiu, C. Li, W. Wu, S. Y. Chang

*此作品的通信作者

研究成果: Review article › 同行評審

35 引文 斯高帕斯（Scopus）

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Keyphrases

Engineering

Material Science

Chemical Engineering