Design on ESD protection scheme for IC with power-down-mode operation

Ming-Dou Ker*, Kun Hsien Lin

*此作品的通信作者

    研究成果: Article同行評審

    16 引文 斯高帕斯(Scopus)

    摘要

    This paper presents a new electrostatic discharge (ESD) protection scheme for IC with power-down-mode operation. Adding a VDD ESD bus line and diodes into the proposed ESD protection scheme can block the leakage current from I/O pin to VDD power line and avoid malfunction during power-down operation. The whole-chip ESD protection design can be achieved by insertion of ESD clamp circuits between VSS power line and both the VDD power line and VDD ESD bus line. Experiment results show that the human-body model (HBM) ESD level of this new scheme can be greater than 7.5 kV in a 0.35-μm silicided CMOS process.

    原文English
    頁(從 - 到)1378-1382
    頁數5
    期刊IEEE Journal of Solid-State Circuits
    39
    發行號8
    DOIs
    出版狀態Published - 8月 2004

    指紋

    深入研究「Design on ESD protection scheme for IC with power-down-mode operation」主題。共同形成了獨特的指紋。

    引用此