Design of AC-coupled circuit for high-speed interconnects

Chun Wei Huang*, Kai Jen Liu, Yu Jung Huang, Ming Kun Chen, Yi Lung Lin, Ming-Dou Ker

*此作品的通信作者

    研究成果: Conference contribution同行評審

    3 引文 斯高帕斯(Scopus)

    摘要

    The scaling of semiconductor technology together with 3D IC stacking integration make it possible for many portable electronics to process large amount of multimedia data. AC-coupling enables chip placed face-to-face for signal transmission using close-field capacitive coupling. A high performance system design using AC coupled interconnect (ACCI) technology not only achieves shorter and faster interconnection between dies but also increases packaging density. This paper describes a chip-to-chip circuit design suitable for high-speed 3DIC interconnected applications. The AC-Coupled face-to-face (F2F) chip was simulated using HSPICE with TSMC 0.18-μm 1P6M CMOS technology process file under a 1.8 V supply voltage. The simulation results indicated the proposed circuit with the self-test characteristics can achieve differential signal transmission up to 2.5 Gbps.

    原文English
    主出版物標題2012 IEEE Global High Tech Congress on Electronics, GHTCE 2012
    頁面87-90
    頁數4
    DOIs
    出版狀態Published - 1 12月 2012
    事件2012 IEEE Global High Tech Congress on Electronics, GHTCE 2012 - Shenzhen, China
    持續時間: 18 11月 201220 11月 2012

    出版系列

    名字2012 IEEE Global High Tech Congress on Electronics, GHTCE 2012

    Conference

    Conference2012 IEEE Global High Tech Congress on Electronics, GHTCE 2012
    國家/地區China
    城市Shenzhen
    期間18/11/1220/11/12

    指紋

    深入研究「Design of AC-coupled circuit for high-speed interconnects」主題。共同形成了獨特的指紋。

    引用此