@inproceedings{f710460714cd4166bc32c80c7d74e822,
title = "Design of AC-coupled circuit for high-speed interconnects",
abstract = "The scaling of semiconductor technology together with 3D IC stacking integration make it possible for many portable electronics to process large amount of multimedia data. AC-coupling enables chip placed face-to-face for signal transmission using close-field capacitive coupling. A high performance system design using AC coupled interconnect (ACCI) technology not only achieves shorter and faster interconnection between dies but also increases packaging density. This paper describes a chip-to-chip circuit design suitable for high-speed 3DIC interconnected applications. The AC-Coupled face-to-face (F2F) chip was simulated using HSPICE with TSMC 0.18-μm 1P6M CMOS technology process file under a 1.8 V supply voltage. The simulation results indicated the proposed circuit with the self-test characteristics can achieve differential signal transmission up to 2.5 Gbps.",
keywords = "AC-Coupled, Differential signal transmission, High-speed interconnected, Three-dimensional integrated circuit (3D IC)",
author = "Huang, {Chun Wei} and Liu, {Kai Jen} and Huang, {Yu Jung} and Chen, {Ming Kun} and Lin, {Yi Lung} and Ming-Dou Ker",
year = "2012",
month = dec,
day = "1",
doi = "10.1109/GHTCE.2012.6490130",
language = "English",
isbn = "9781467350853",
series = "2012 IEEE Global High Tech Congress on Electronics, GHTCE 2012",
pages = "87--90",
booktitle = "2012 IEEE Global High Tech Congress on Electronics, GHTCE 2012",
note = "2012 IEEE Global High Tech Congress on Electronics, GHTCE 2012 ; Conference date: 18-11-2012 Through 20-11-2012",
}