Design, fabrication and actuation of thermal actuating XY stage

Chun Ying Lin*, Tsung Ying Tsai, Jin-Chern Chiou

*此作品的通信作者

研究成果: Conference contribution同行評審

摘要

This work presents a thermal actuating XY-stage by using MEMS-based (micro-electro-mechanical system) technologies. The proposed stage is designed as a decoupling XY stage has dimensions of 8.8 × 8.8 × 0.2 mm 3 and contains a two-axis decoupling XY stage and has sufficient strength to suspend an image sensor used for anti-shaking function. The processes used to fabricate the stabilizer include Silicon on Isolator (SOI) process, inductively coupled plasma (ICP) processes and HF vapor process. The maximum actuating distance of the stage is larger than 25μm which is sufficient to resolve the shaking problem. Accordingly, the applied voltage for the 25μm moving distance is lower than 20volts. Moreover, the dynamic resonant frequency of the actuating device is 3.5 kHz.

原文English
主出版物標題4th IEEE International NanoElectronics Conference, INEC 2011
DOIs
出版狀態Published - 26 9月 2011
事件4th IEEE International Nanoelectronics Conference, INEC 2011 - Tao-Yuan, Taiwan
持續時間: 21 6月 201124 6月 2011

出版系列

名字Proceedings - International NanoElectronics Conference, INEC
ISSN(列印)2159-3523

Conference

Conference4th IEEE International Nanoelectronics Conference, INEC 2011
國家/地區Taiwan
城市Tao-Yuan
期間21/06/1124/06/11

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