Design, fabrication and actuation of four-axis thermal actuating image stabiliser

Chun Ying Lin*, Jin-Chern Chiou

*此作品的通信作者

研究成果: Article同行評審

5 引文 斯高帕斯(Scopus)

摘要

Presented is a microelectromechanical system-based thermal actuating image stabiliser. The proposed stage has dimensions of 14.9×14.9×0. 2mm3 and contains a four-axis decoupling XY stage used for anti-shaking. The processes used to fabricate the stabiliser include silicon on isolator process, inductively coupled plasma process and flip-chip bonding technique. The maximum actuating distance of the stage is larger than 25m, which is sufficient to resolve the shaking problem in 3× optical zoom condition. According to the experiment results, the supplied voltage for the 25m moving distance is lower than 20V, and the dynamic resonant frequency of the actuating device is 4.7kHz.

原文English
頁(從 - 到)549-552
頁數4
期刊Micro and Nano Letters
6
發行號7
DOIs
出版狀態Published - 1 7月 2011

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